Thermistor
Chip Elements
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Chip
Configuration:
The
basic configuration
of "chip" thermistor
elements is shown
in Figure #1. The
thermistor material
is metalized on
the top and bottom
surfaces for electrical
contact. Metalization
of the thermistor
material is performed
by dipping or screen
printing with conductive
ink based on materials
such as silver
or gold. The ink
is fired to the
wafers of the thermistor
material. The wafers
are then diced
by mechanical saw
or by laser scribing
to produce chips
of specific sizes.
The length, width
and thickness are
controlled dimensions
for specific chip
element products.
Typical chip dimensions
are 1mm x 1mm x
0.25mm thick.
BetaTHERM supplies leadless "chip" thermistor
elements for applications
where die bonding and wire
bonding assembly techniques
are used for circuit connections.
The elements can be supplied
in vials or "waffle" packs.
Typical
Chip Thermistor
Figure
# 1
BetaTHERM’s
chip elements are
used to produce
components with
wire leads which
are coated with
thermally conductive
epoxy as illustrated
in Figure # 2.
Figure
# 2
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